The main benefits of Vacuum Soldering during soft-soldering-process up to 450 ° C through the controlled use of gases during assembly process are:

• Bonding surfaces free from oxide and cavities, ranging from chip to ceramic substrate
• Integrated or separate implementation of cleaning and scaling processes
• No or only very minor amounts of residual contamination on the product
• No degassing processes on the product
• Different pressure areas can be created inside of the sealed chambers
• Sealing of chambers with a previously defined gas atmosphere
• Assembly in high vacuum
• Integration of drying and degassing processes
• Possibility of a further miniaturization
• The better derivation of heat loss
• A considerably increased yield in production

The new VS160 S benchtop vacuum soldering system with plate size 160 mm x 160 mm and max. soldering temperature 450 °C. Process gasses. Heat up / cool down 3 K/s. Process gases N₂; N₂H₂ 95/5%.

Options

• Absolute pressure measurement
• Rotary vane pump with accessories
• Datalogging software
• Frame for gas inlet and pump adaption
• Formic acid gas line with bubbler

The new VS 320 vacuum soldering system with plate size 320 mm x 320 mm and max. soldering temperature 450 °C. Process gasses. Heat up / cool down 2,5 K/s. Process gases N₂; N₂H₂ 95/5%; H₂ up to 100%.

Options

• Formic acid gas with bubbler
• Maximun of 5 gas lines
• Datalogging software
• Integrated plasma equipment
• High vacuum pump