Induction soldering for high energy transfer.
Contactless heating with traditional open inductor.
Or with inductor embedded in ceramic for adding pressure during the soldering operation.
At a multiplicity of applications there are joints, which must be soldered individually: Cables, plugs, special construction components and modules with only a few solder joints.
A further application is the use of special elements, e.g. plugs and pinthrough- hole on SMD-Boards. Often single point soldering is required because of assembling, e.g. if a completely equipped PCB is inserted into a housing and has to be connected with plugs or other components by soldering.
Automation of these single point soldering processes does not only afford a cost-efficient mass production, it is also demanded to obtain a constant high quality. Thus, it cannot be done without automated single point soldering in the modern electronics manufacturing.
Laser soldering allows an accurate focusing and thus the soldering of smallest solder joints. The special advantages of this procedure are:
- contactless heat transfer
- accurate focusing
- high power density
- high quality soldering joints with high process reliability
For induction soldering a secondary spool, the soldering inductor, is connected with a high-frequency generator. The alternating current flow in the inductor induces a magnetic field. Eddy currents in the soldering joint caused by that magnetic field effect the heating up to the soldering temperature.
In order to avoid a warming up of the inductor, cooling water is pumped through the hollow spool wire. Induction soldering makes a large energy transfer possible.
A further advantage of this procedure is the low expense for maintenance.